Teralab recently published book "Electrical Design of Through Silicon Via"

Professor Joungho Kim and the members of Teralab co-worked to publish this book and in 2014, it was published by the Springer company

 

The book

-Provides fundamental modeling of TSV which is a very essential part of 3D ICs

-Includes both numerical formula analysis and qualitative explanations

-Approch from various view points: SI, PI and etc.

-Has appeal for academia and industry

To lear more bout the book, please view flyer linked ( view / download )

Direct link to the Springer Homepage ( link )