Package Manufacturing Date

2006.10

  SiP Serial Number

Tera S0607.1

  Chip Designer

Sungjoon Jang (VLSI System Lab, KAIST)
  Dynalith Systems Co., Ltd

  Package Designer

Jungho Shin (Amkor), Hyunjeong Park
  (Tera Lab, KAIST)

  Package Manufacturer

Amkor Technology Korea

  SiP Function

High performance MPU
  (Microprocesser unit)

  Package Type

PBGA

  No. of Die

1

  Substrate Stack up

BT / 4 Layer

  No. of Ball

256 (Power : 52 balls, Ground : 57 balls)
  Package Size 17mm X 17mm

  Package Manufacturing Date

2006.12

  SiP Serial Number

Tera S0612.1

  Chip Designer

Semiconductor System Lab., KAIST

  Package Designer

Jiheon Yu (Amkor), Eakhwan Song,
  Woojin Lee (KAIST)

  Package Manufacturer

Amkor Technology Korea

  SiP Function

Transmitter for Near Field Communication
  (NFC)

  Package Type

CABGA

  No. of Die

1 (2.4GHz OOK modulator)

  Substrate Stack up

BT resin/ 4 Layer

  No. of Ball

324
  Package Size 19mm X 19mm

  Package Manufacturing Date

2006. 11

  SiP Serial Number

Tera S0611.1

  Chip Designer

RadioPulse

  Package Designer

Taeshin Kang(Amkor), Jaemin Kim,
  Myunghyun Ha(KAIST)

  Package Manufacturer

Amkor

  SiP Function

ZigBee

  Package Type

CABGA

  No. of Die

2 (Core Die, Memory Die)

  Substrate Stack up

FR4 / 4 Layers

  No. of Ball

100
  Package Size 10mm X 10mm

  Package Manufacturing Date

2006. 11

  SiP Serial Number

Tera S0701. 1

  Chip Designer

Changwook Yoon (KAIST), Youngjin Park

  Package Designer

Changwook Yoon (KAIST)

  Package Manufacturer

LabTech

  SiP Function

UWB Transceiver

  Package Type

PBGA

  No. of Die

2

  Substrate Stack up

5

  No. of Ball

42
  Package Size 25mm X 10mm

  Package Manufacturing Date

2006. 07

  SiP Serial Number

Tera S0606. 1

  Chip Designer

TriQuint Semiconductor

  Package Designer

Jongbae Park, KAIST

  Package Manufacturer

KETI

  SiP Function

X/Ku-band Transceiver

  Package Type

CBGA

  No. of Die

7 (Pa, LNA, DA, 4 Switches)

  Substrate Stack up

LTCC Dupont / 8 Layer

  No. of Ball

289
  Package Size 20mm X 20mm

  Package Manufacturing Date

2006. 04

  SiP Serial Number

Tera S0602. 1

  Chip Designer

ETRI, CoreLogic

  Package Designer

Ho Choi (AMKOR), Jaemin Kim (KAIST)

  Package Manufacturer

Amkor Technology Korea

  SiP Function

T-DMB (Stacking Type)

  Package Type

LGA

  No. of Die

3 (System Die, SRAM, SDRAM)

  Substrate Stack up

RF4 / 4 Layer

  No. of Ball

256 (Power : 55 balls, Ground : 55 balls)
  Package Size 11mm X 11mm

  Package Manufacturing Date

2006. 02

  SiP Serial Number

Tera S0601. 1

  Chip Designer

ETRI, CoreLogic

  Package Designer

JaeUng Lee (AMKOR), Jaemin Kim (KAIST)

  Package Manufacturer

Amkor Technology Korea

  SiP Function

T-DMB (Planar Type)

  Package Type

LGA

  No. of Die

5 (Multimedia,Baseband,RF,SDRAM,SRAM)

  Substrate Stack up

RF-4 / 4 Layer

  No. of Ball

279(Power : 85balls, Ground : 69 balls)
  Package Size 18mm X 18mm

  Package Manufacturing Date

2006. 03

  SiP Serial Number

Tera S0603. 1 , Tera S0604. 2

  Chip Designer

System Chip Integration Lab. of CNU

  Package Designer

Chunghyun Ryu, KAIST

  Package Manufacturer

LabTech. & Aspect Solution

  SiP Function

13.56MHz RFID Reader with Antanna

  Package Type

PBGA

  No. of Die

2 (RFID chip, MCU)

  Substrate Stack up

LTCC / 4 Layer

  No. of Ball

136 (Power : 46 balls, Ground : 46 balls)
  Package Size 30mm X 30mm

  Package Manufacturing Date

2006. 03

  SiP Serial Number

Tera S0604. 1 , Tera S0604. 2

  Chip Designer

System Chip Integration Lab. of CNU

  Package Designer

Chunghyun Ryu, KAIST

  Package Manufacturer

LabTech. & Aspect Solution

  SiP Function

13.56MHz RFID Reader with Antanna

  Package Type

PBGA

  No. of Die

2 (RFID chip, MCU)

  Substrate Stack up

FR4 / 4 Layer

  No. of Ball

136 (Power : 46 balls, Ground : 46 balls)
  Package Size 30mm X 30mm

  Package Manufacturing Date

2006. 03

  SiP Serial Number

Tera S0605. 1

  Chip Designer

System Chip Integration Lab. of CNU

  Package Designer

LabTech. & Aspect Solution

  Package Manufacturer

Amkor Technology Korea

  SiP Function

13.56MHz RFID Reader

  Package Type

PBGA

  No. of Die

2 (RFID chip, MCU)

  Substrate Stack up

FR4 / 4 Layer

  No. of Ball

72 (Power : 13 balls, Ground : 13 balls)
  Package Size 12mm X 12mm

  Package Manufacturing Date

2004. 11

  SiP Serial Number

 

  Chip Designer

Kangmin Lee, SSL Lab, KAIST

  Package Designer

Jinhan Kim (Amkor), Gawon Kim(KAIST)

  Package Manufacturer

Amkor Technology Korea

  SiP Function

NiP (Network-in-Package)

  Package Type

PBGA

  No. of Die

4 (Network-on-Chip)

  Substrate Stack up

BT / 4 Layer

  No. of Ball

680 (Power : 162 balls, Ground : 179 balls)
  Package Size 35mm X 35mm