. Name : Joungho Kim
. E-mail : joungho@kaist.ac.kr
. Tel : +82-42-350-3458


Dr. Joungho Kim received B.S. and M.S. degrees in electrical engineering from Seoul National University, Seoul, Korea, in 1984 and 1986, respectively, and Ph.D degree in electrical engineering from the University of Michigan, Ann Arbor, in 1993. In 1994, he joined Memory Division of Samsung Electronics, where he was engaged in Gbit-scale DRAM design. In 1996, he moved to KAIST (Korea Advanced Institute of Science and Technology). He is currently Electrical Engineering Department ICT Endowed Chair Professor and Research Director at KAIST. Also, he is director of 3DIC-RC (3DIC Research Center) supported by Hyniz Inc., and SAE-RC (Smart Automotive Electronics Research Center) supported by KET Inc.

Since joining KAIST, his research centers on EMC modeling, design, and measurement methodologies of 3D IC, System-in-Package(SiP), multi-layer PCB, and wireless power transfer technology. Especially, his major research topic is focused on chip-package co-design and simulation for signal integrity, power integrity, ground integrity, timing integrity, and radiated emission of 3D IC and SiP. He has successfully demonstrated low noise and high performance designs of numerous SiP’s for wireless communication applications such as ZigBee, T-DMB, NFC, and UWB. He was on a sabbatical leave during an academic year from 2001 to 2002 at Silicon Image Inc., Sunnyvale CA. He was responsible for low noise package designs for SATA, FC, HDMI, and Panel Link SerDes devices. From 2010, he started a new research on wireless power transfer technology using magnetic field resonance. He has been one of the co-leaders in a national project, OLEV (Online Electrical Vehicle), for EMI and EMF reduction design. The OLEV was selected as one of the 50 Best Inventions in 2010 by Times Magazine.

He has authored and co-authored over 520 technical papers published at refereed journals and conference proceedings in modeling, design, and measurement of 3D IC, SiP, PCB, and wireless power transfer. Also, he has given more than 259 invited talks and tutorials at the academia and the related industries. He was the Symposium Chari of the 2015 IEEE EDAPS, Seoul, Korea, and Joint Conference Chair of the Japan-Korea Microwave Society in 2015. He was also the Conference Chair of the Japan-Korea Microwave Society in 2015. He was also the Conference Chair of the 2014 IEEE Wireless Power Transfer Conference (WPTC), Jeju, Korea, and the Symposium Chair of the 2008 IEEE EDAPS and the Technical Program Committee (TPC) Chair of the 2011 APEMC. He was appointed an IEEE Electromagnetic Compatibility (EMC) Society Distinguished Lecturer from 2009 to 2001 and appointed fellow in 2016 for contributions to modeling signal and power integrity in 3D integrated circuits. He is a TPC Member of Electrical Performance of Electronic Packaging and System. He is an Associate Editor for the IEEE Transactions on Eectromagnetic Compatibility. He was a Guest Editor of a Special Issue of the IEEE Transactions on Electromagnetic Compatibility on PCB level signal integrity, power integrity, and electromagnetic interference/compatibility in 2010, a Special Issue of the IEEE Transactions on Advanced Packaging on TSV in 2011, and a Mini-Special Issue on the 2014 IEEE WPTC of the IEEE Transactions On Microwave Theory and Techniques in 2014. He was a recipient of the Outstanding Academic Achievement Faculty Award of KAIST in 2016, the KAIST Grand Research Award in 2008, the National 100 Best Project Award in 2009, the KAIST International Collaboration Award in 2010, the KAIST Grand Research Award in 2014, and the Technology Achievement Award of the IEEE Electromagnetic Society in 2010.




AFFILIATION


Professor
School of Electrical Engineering
KAIST (Korea Advanced Institute of Science and Technology)
373-1 Kusong-dong, Yusung-gu, Taejon 305-701, Korea
Tel) +82-42-350-3458 Fax)+82-42-350-8058
E-mail) joungho@kaist.ac.kr
Website) http://tera.kaist.ac.kr


HOME ADDRESS:


Hyundai APT 103-806
Doryong-dong, Yusong-gu,
Taejon, Korea, 305-340


RESEARCH INTERESTS:



TSV-Based 3D IC Design
2.5 D Interposer and HBM Design
Signa integrity and Power integrity co-design
Chip-Package Co-design, SiP(System-in-Package) Design,
EMC of Automotive Vehicle, Electrical Vehicle, Automotive Semiconductors
EMF and EMC of Wireless Power Transfer Technology



EDUCATION:


Ph.D., Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, Michigan, September, 1993.
Thesis title: Ultrafast Optical Techniques for High-speed Devices and MM-Wave Circuit Testing.
Adviser : Prof. Gerard Mourou

Master of Science, Electrical Engineering, Seoul National University, Seoul, Korea, February, 10, 1986.

Bachelor of Science, Electrical Engineering, Seoul National University, Seoul, Korea, February, 10, 1984.


EXPERIENCE:


Professor, Department of Electrical Engineering and Computer Science, KAIST (Korea Advanced Institute of Science and Technology), March, 2005 to present.

Associate Professor, Department of Electrical Engineering and Computer Science, KAIST(Korea Advanced Institute of Science and Technology), March, 1999 to 2005.

Assistant Professor, Department of Electrical Engineering and Computer Science, KAIST(Korea Advanced Institute of Science and Technology), March, 1996 to February, 1999.

Staff Engineer, SilImage Inc. Signal Integrity and Package Design engineer, from July 2001 to Aug. 2002. Technical consultant, 2002-present

Principle Research Engineer, Samsung Electronics Inc. in Korea, September, 1994 to January, 1996.
• 1 Gbit DRAM Design
• 16 Mbit DRAM Design

Research Engineer, Picometrix Inc. in U.S, September, 1993 to July, 1994.
•Design of 70 GHz PX-D7 Photo-receiver Module
•Design and fabrication of MSM LT-GaAs photo-detector.
•Ultrafast Picosecond Sampling System.

Research Assistant, University of Michigan, January, 1990, to July, 1993.

 



ACADEMIC ACTIVITIES:


     • Conference Chair, IEEE EDAPS (Electrical Design of Advanced Package and Systems), 2015
• Korea-Japan Microwave Joint Conference (KJJC.2015 Tohoku Univ.), Conference co-chiar
• IEEE WPTC, International Advisory Committee Member, 2015-
• IEEE Transactions Microwave Theory and Techniques, Guest Editor, Mini-Special Issue Paper on IEEE WPTC2014, “Wireless Power Transfer Technology,” 2014-2015
• Conference Chair, IEEE Wireless Power Transfer Conference (IEEE WPTC 2014,) Jeju Island, Korea
• TPC member, IEEE 3D IC Conference, 2013-
• International Advisory Board Member, 2013, 2014 EMC Europe Symposium, 2012-present
• TPC Member, DATE (Design Automation and Test in Europe) 2013 Symposium, 2013- present.
• TPC member, IEEE MTT-s, International Microwave Workshop Series on Innovative Wireelss Power Transmission Technologies, Systems, and Applications. (IMWS-IWPT2012), 2011-present
• APEMC 2010- present, International Steering Committee Member,
• IEEE EDAPS 2008- present, International Steering Committee Member,
• AP-EMC 2011 Conference, TPC Chair (Technical Program Chair), 2010, May
• IEEE Transactions on Advanced Packaging, Guest Editor, Special Issue Paper, on “TSV(Through Silicon Via) ” 2010.
•EPEPS (Elcetrical Performance of Electronic Packaging and System) Technical Program Committee Member, 2010-present
•IEEE Electromagnetic Compatibility Society, Distinguished Lecturer, 2009-present
• IEEE Electromagnetic Compatibility Society, Education Committee Member, 2009-present
• IEEE Transactions on Electromagnetic Compatibility, Associated Editor: 2004- present
• IEEE Transactions on Electromagnetic Compatibility, Guest Editor, Special Issue Paper on, “PCB Level Signal Integrity, Power Integrity, and EMI/EMC” 2009-present
• EMC Kyoto Symposium, 2009, Special session chair, “IC Level EMI/EMC.”
• IEEE EDAPS (Electrical Design of Advanced Package and Systems), Symposium general chair, Seoul, 2008
• IEEE EDAPS (Electrical Design of Advanced Package and Systems), International Steering Committee, 2002-present
• VLSI Package Workshop, Kyoto, International Program Committee, 2008-present
• AsiaPacific-EMC, Special Session Chair, Singapore, 2007.
•AsiaPacific-EMC, Technical Program Committee Member, Singapore, 2007-present
• IEEE EMC Symposium, International Committee Member, Hawai, 2007.
• IEEE EMC Symposium, Special Session Chair, Hawai, 2007.
• IEEE ASSCC Panel Session Chair: SoC or SiP, Jeju Island, 2007.
• IEEE EPTC, Technical Program Committee Member, Singapore, 2005-present
• IEEE EDAPS (Electrical Design of Advanced Package and Systems) 2003, Symposium General Chair, Seoul
• Korea Microwave Engineering Society, Committee Chair in Package Group in 1998-present
• IEEE senior member, 2011-present.
• IEEE member, 1996- 2011.
• IEEE student member, 1990

 

• Technical Consultant,LG Electronics., 2014-
Review Board Member, Korea Reseach Foundation, 2010-2013
• Korean EMC Committee, D-Session, Committee Chair, 2012-
• Technical Consultant, Hyundai Mobis Inc., 2011-2012
• Technical Consultant, SiliconImage Inc., 2002-present
• Technical Consultant, Hyundai Motors Inc., 2005-2006




HONORS:


Korea Government Merit Scholarship for Studying Abroad, 1989.


AWARDS:


KAIST Best Research Faculty Award, 2014. 2
10TH Samsung Electro-Mechanics 2014 indside edge Special Prize Award, 2014.11
20TH Edition Recognition Award, 2011 IEEE International Conference on Electrical Performance of Electronic Packages and Systems, 2011.10
IEEE Distinguished Lectuerer Award, IEEE EMC Society, 2011.8.
Honorable Mention Outstanding Project Advisor Award: FDC (Freshman Design Course), 2010.7.
IEEE EMC Society Technology Achevement Award, 2010.7
KAIST Best International Collaboation Award, 2010.2
Industry Collaboration Award, Ministry of Education, 2009.10
KAIST Best Research Faculty Award, 2008. 2
KAIST Faculty Academic Achievement Award, 2006.2