Year

Subject

Place

Date

2014

  TeraByte/s High-Bandwidth and Low Noise Interposer Design for 2.5D/3D IC

Tutorial DesignCon, San Jose, CA
2014. 01. 28
  Automotive Area: EMC Technology Roadmap
EMC Technology Roadmap, Seoul, Korea
2014. 02. 06
  Design of TSV and Interposer for TeraByte/s Data-Bandwidth 2.5D/3D IC
KIMM, Daejon
2014. 03. 06
  Basic Principles of Wireless Power Transfer Using Magnetic Field Resonance
Hyundai Mobis, Kyunggido, Korea
2014. 04. 03
  Automotive Electromagnetic Emission and Compatibility: From Semiconductor to System
Korea Airospace Insdtitute: Daejon, Korea
2014. 06. 12
  TeraByte/s High-Bandwidth and Low Noise Interposer Design for 2.5D/3D IC
Altera, San Jose, CA
2014. 06. 27
  TeraByte/s High-Bandwidth and Low Noise Interposer Design for 2.5D/3D IC
Intel, San Jose, CA
2014. 06. 30
  TeraByte/s High-Bandwidth and Low Noise Interposer Design for 2.5D/3D IC
Rambus, San Jose, CA
2014. 06. 30
  TeraByte/s High-Bandwidth and Low Noise Interposer Design for 2.5D/3D IC
LG, Seoul, Korea
2014. 08. 15
  Wireless Power Transfer for Semiconductors using Magnetic Field Resonance
WPT workshop, Samsung, Seoul
2014. 09. 30
  Design of Digital Automotive Vehicles and EMC Simulation Technologies
KIEEE Workshop on Automotie Vehicles
2014. 09. 02
  High-Power and High-Efficiency Wireless Power Charging System for Electric Automotive Vehicles and Electromagnetic Compatibility Design Challenges
IEEE Vehicular Technology ConferenceVancouver, Canada
2014. 09. 17
  TeraByte/s Data-bandwidth TSV and Interposer Design for 2.5D and 3D IC
LG, Seoul, Korea
2014. 09. 26
  Electromagnetic Field Design and Simulation Methodologies for Electronic Automotive Vehicles
ANSYS Expo, Seoul, Korea
2014. 10. 07
  Research Education Activities of 2.5D/3D IC In Korea
Hochimin City, 4S-AVIC workshop, Vietnam
2014. 10. 24
  TeraByte/s Data-bandwidth TSV and Interposer Design for 2.5D and 3D IC
“ EPEPS 2015, Tutorial, Portland, Oregon
2014. 10. 26
  EMC Simulation and Measurement in Electric Automotive Vehicles
EPEPS 2015, Invited speech, Portland, Oregon
2014. 10. 28
  Active Interposers for 2.5D and 3D IC
Keynote speech, GIT workshop, GaTech, GA
2014. 11. 07
  TeraByte/s Data-bandwidth TSV and Interposer Design for 2.5D and 3D IC
Hamamatsu, Shizuoka University, Symposium Keynote speech, Japan
2014. 11. 11
  EMC Design and Simulation Technologies for Future Smart Electric Vehicles
EMC Fest, Kyunggido, Korea
2014. 11. 27
  Signal and Power Integrity Design of TSV and Interposer Design for 2.5D/3D IC
Tutorial, EDAPS2014, Bangalore, India
2014. 12. 14
  Automotive Vehicle Wireless Power Transfer Technology and EMI challenges
Keynote speech, EDAPS2014, Bangalore, India
2014. 12. 14
 
Year

Subject

Place

Date

2013

  Signal Integrity Modeling and Measurement of TSV in 3D IC

ASPDAC Conference, Yokohama, Japan
2013. 01.28

  Signal Integrity Design of TSV and Interposer for TeraByte/s Bandwidth 2.5D/3D Semiconductor Systems

Xilinx, San Jose, CA, USA
2013. 01. 28

  Signal Integrity Design of TSV and Interposer for TeraByte/s Bandwidth 2.5D/3D Semiconductor Systems

Altera, Santa Clara, CA, USA
2013. 02. 01

  Electrical Design of TSV and Interposer

Semiconductor Conference, Sungwoo Resort, Korea
2013. 02. 04

  Signal Integrity Design of TSV and Interposer in 3D IC

Cuzco, Peru, LASCAS
2013. 02. 28

  TSV and Interposer Design for 2.5D/3D IC,” LG Innotek Inc

Kumi, Korea
2013. 03. 07

  Design of TSV and Interposer for 2.5D Semiconductor Systems with a TeraByte/s Data-bandwidth

UNID Inc., Sungnam, Korea
2013. 03. 26

  Electrical Design and Characterization of Interposers

Gatech PRC IAB meeting, GaTech, Atlanta, GA, USA
2013. 05. 21

  Wireless Power Transfer Technology for Automotive Applications

Automotive EMC workshop, KTL, Hwasung, Korea
2013. 07. 25

  Si and Glass Interposer Technology for Future High-Density and High-Performance 3D IC

Samsung Corning, Hwasung, Korea
2013. 07. 31

  High-Bandwidth and Low Noise TSV and Interposer Design for 2.5D/3D IC

IEEE EMCS, Denver, CO, USA
2013. 08. 09

  Electrical Design and Characterization of Si and Glass Interposer

GaTech-KAIST TSV and Interposer Workshop, KAIST
2013. 08. 14

  Automotive EMC,” Mando Inc

Pankyo, Korea
2013. 08. 23

  Electromagnetic Compatility of Automotive Vehicles

Mano Inc, Pankyo, Korea
2013. 08. 28

  Wireless Power Transfer Technology

ANSYS Workshop, Kyungjoo, Korea
2013. 09. 05

  Power Integrity Design,” Hyundai Autron, Totorial

Pankyo, Korea,
2013. 09.15

  TSV and Interposer Design for High Performance and Losw Noise Interposer for 2.5D/3D IC

IEEE 3D IC Conference, San Francisco, USA
2013. 10. 03

  Wireless Power Transfer Technology for Automotive Applications

SiImage Inc., San Jose, CA
2013. 10. 29

  Wireless Power Transfer Technology using Magnetic Field Resonance and Key Applications

APMC, APMC conference, Korea
2013. 11. 07

  Wireless Power Transfer Technology using Magentic Field Resonance and Key Applications

Asia Pacific Microwave Conference
2013. 11. 08

  Wireless Power Transfer Technology for Automotive Applications

Hyundai Motor Korea, NamYang, Korea
2013. 11. 14

  TeraByte/s bandwidth Interposer Design using Si/Glass/Organic substrate

GaTech GIT conference, GaTech, Atlanta, GA
2013. 11. 19

  Future Digital Electric Automotive Vehicles

KAIST Techno-Business Program
2013. 11. 25

  EMC Designs of Automotive Integrated Circuits

Hyundai Motor Korea, NamYang, Korea
2013. 12. 05
 
Year

Subject

Place

Date

2012

  Challenge and Opportunity of TSV Technology
Samsung Electronics
2012. 03. 28
  Basic Principles and Key Applications of Wireless Power Transfer Technology using Magnetic Field Resonance
Korea Microwave Society Workshop
2012. 04. 04
  Electrical Design of TSV
MSPNEX 2012 Technology and Applications of 3D-IC Integration Workshop
2012. 04. 12
  Wireless Power Transfer Technology for Online Electrical Vehicle (OLEV) System
Nikkei Electronics Workshop, Tokyo, Janpan
2012. 04. 27
  Automotive EMI and EMC
Korea Electronics Institue Workshop on Automotive EMC
2012. 05. 18
  Equalizer Design for High-speed Channel

APEMC 2012 Symposium,
Singpoare

2012. 05. 21
  Through Silicon Via (TSV) Design and Measurement for Terabit Data-Bandwidth of 3D IC
APEMC 2012 Symposium,
Singpoare
2012. 05. 22
  Automotive EMC
Hyundai Autron Inc.
2012. 07. 04
  Wireless Power Transfer Technology
ANSYS Forum,
Seoul Lotte Hotel
2012. 07. 10
  Wireless Power Technology
NIP Seminar,
Seoul National University
2012. 07. 11
  Design of TSV and Interposer for 2.5D Mobile Semiconductor Systems with a TeraByte/s Data Bandwidth
Qualcomm, San Diego
2012. 08. 02
  Interposer Development for 2.5D Mobile Semiconductor Systems
GigaLane, Suwon, Korea
2012. 08. 22
  Interposer Development for 2.5D Mobile Semiconductor Systems
Daeduck Electronics, Ansan
2012. 08. 27
  Design of TSV and Interposer for 2.5D Mobile Semiconductor Systems with a TeraByte/s Data Bandwidth
Amkor Technology, Seoul
2012. 09. 06
  Wireless Power Transfer Technology using Magentic Field Resonance: Principles and Key Applications
RFIC Technology Workshop, Jeju Island
2012. 09. 20
  TeraByte/s Bandwidth TSV and Interposer

3D IC workshop, Kyunghee University

2012. 09.27
  TSV Based Interposer and 3D IC
WillTechnology, Suwon, Korea
2012. 10. 09
  Si Vs Glass Interposer: I/O bandwidth, Power, and Noise Coupling
IEEE GIT Workshop, Atlanta,
2012. 11. 15
  Wireless Power Transfer Technology and Key Applications Based on Magentic Field Resonance
Samsung LSI Colloqium, Suwon, Korea
2012. 11. 20
  Signal Integrity Design of TeraByte/s TSV and Interposer for Future 3D IC
PanPacific EMC (PPEMC) Workshop, Tokyo, Japan
2012. 11. 29
 
Year

Subject

Place

Date

2011

  High speed Channel Design of TSV based 3D IC
KAIST 3D IC Workshop
2011. 01. 07
  EMC Design and Measurement of Automotive Semiconductors
KAIST Digital Automotive Workshop
2011. 01. 11
  Signal Integrity Design of TSV based 3D IC
ASP-DAC, Japan
2011. 01. 25
  High Efficiency Wireless Power Transfer Technology and Applications
KAIST
2011. 04. 27
  OLEV Wireless Power Transfer Technology
EMC D Committee Meeting
2011. 05. 03
  Resonant Magnetic Field Technology for High Power and Enhanced Efficiency Wireless Power Transfer
IEEE IMWS IWPT Workshop, Kyoto Japan
2011. 05. 12
  Design Applications for Power Distribution Network
APEMC 2011, Jeju Island
2011. 05. 19
  Wireless Power Transfer Technology for OLEV
Electrical Vehicle Exhibition Workshop
2011. 05. 26
  High Efficiency Wireless Power Transfer using Magnetic Field Resonance
ETRI
2011. 06. 07
  High Efficiency Wireless Power Transfer using Magnetic Field Resonance
Samsung
2011. 06. 07
  EMP Protection Circuit Design for Electronic Warfare
KAIST Electronic and Cyber Warfare Workshop
2011. 06. 28
  TSV based 3D IC Technology and Future Perspectives
Hynix
2011. 07. 11
  EMC Reliability Design and Measurement of Automotive Semiconductor
Hyundai Mobis
2011. 07. 26
  TSV Based 3D IC Design and IP
NIP Course
2011. 07. 27
  Design of 3D System-in-Package and IC for Wireless and Militay Applications
Military Academic Society Workshop
2011. 11. 02
  Low Noise Design of Mixed Mode 3D SiP and IC
Plenary speech, Chip EMC Workshop, Tokyo, Japan
2011. 12. 19
 
Year

Subject

Place

Date

2010

  TSV Design for Signal Integrity of 3D IC
KAIST
2010. 01. 14
  Signal Integrity of TSV Based 3D IC
HPC Center, Singapore
2010. 01. 28
  IEEE Electromagnetic Compatibility Society Distinguished Lecture
Taiwan
2010. 03. 24
  IEEE Electromagnetic Compatibility Society Distinguished Lecture
Taiwan
2010. 03. 26
  Signal Integrity of TSV Based 3D-IC
Chiness University,
Hong Kong
2010. 05. 06
  Resoanat Magnetic Field Design for High Efficiency and Low EMF Wireless Power Transfer in On-Line Electrical Vehicle
Workshop at Korea
2010. 05. 14
  Signal Integrity Design of 3D IC
Workshop
GaTech, U.S.A
2010. 06. 10
  Design of Electromagnetic Field (EMF) for A Novel On-line Electrical Vehicle (OLEV)
BEMS
Seoul, Korea
2010. 06. 17
  Resoanat Magnetic Field Design for High Efficiency and Low EMF Wireless Power Transfer in On-Line Electrical Vehicle
KAIST, Korea
2010. 06. 18
  Signal Integrity of TSV Based 3D-IC
York, U.S.A
2010. 07. 03
  Resoanat Magnetic Field Design for High Efficiency and Low EMF Wireless Power Transfer in On-Line Electrical Vehicle
LS Industrial Electronics,
Korea
2010. 07. 13
  Resonant Magnetic Field Design for On-line Electrical Vehicle, (OLEV),
Samsung Electronics
2010. 07. 16
  Signal Integrity of TSV Based 3D-IC
Missori University, U.S.A
2010. 07. 21
  Resoanat Magnetic Field Design for High Efficiency and Low EMF Wireless Power Transfer
LS Cable, Korea
2010. 09. 01
  Signal Integrity of 3D System-In-Package
ANSYS Workshop,
Korea
2010. 09. 09
  Resoanat Magnetic Field Design for High Efficiency and Low EMF Wireless Power Transfer
LG Electronics, Korea
2010. 09. 15
  Signal Integrity of TSV Based 3D-IC
IEEE Distinguished Lecture,
Toyama, Japan
2010. 09. 24
  Resoanat Magnetic Field Design for High Efficiency and Low EMF Wireless Power Transfer
2010 Workshop for Microwaves and Millimeter-waves, Korea
2010. 10. 07
  Signal Integrity Design of TSV based 3D IC
Workshop (FDIP)
2010. 10. 24
  TSV Electrical Design
3D TSV Integration Workshop
Suwon Korea
2010. 11. 04
  EMC Issue in 3D IC
Samsung Electronics, Korea
2010. 12. 22
 
Year

Subject

Place

Date

2009

  Automotive Vehicle EMI/EMC and IC-to-System Level Design Approaches
KAIST Research Institute
2009. 02. 05
  Modeling and Design of TSV –Based 3D-IC
EMC 3D (TSV Technology Symposium), Taiwan
2009. 02. 27
  Automotive EMC and Integrated Circuit Design
Samsung Electronics
2009. 04. 15
  Power Integrity of IC and Package
Shanghai Jao Tong University
2009. 06. 17
  Power Integrity of IC and Package
Zhe Jiang University
2009. 06. 18
  Power Integrity of IC and 3D Package
Chapter, Japan
2009. 07. 17
  Signal Integrity of 3D SiP and TSV Based IC
Samsung, Korea
2009. 10. 13
  EMC of Automotive Integrated Circuits
EMC workshop, Korea
2009. 10. 27
  Design of 3D Package
Hong Kong
2009. 12. 02
 
Year

Subject

Place

Date
2008    SiP Design with 3D Chip Integration
ASP-DAC Conference
COEX, Seoul
2008. 01. 24
  3D System-in-Package Design
Semicon-Korea Workshop
COEX, Seoul
2008
  Ground Integrity: Design Principles and Measurements
GaTech
2008. 03. 13
  High-speed Channel Loss in PCB and Equalizer Design
3rd Pan-Pacific EMC
Tokyo Japan
2008. 03. 16
  Chip-Package Co-design and Analysis for Low Noise and High Performance SiP
Dongbu HighTech Inc., Korea
2008. 04. 22
  Design of Low Noise and High Performance SiP
AP-EMC Conference
Singapore
2008. 05. 19
  Chip-Package Co-design and Analysis for High-performance and Low Noise 3D Semiconductor Systems
IBM, TX, Austin
2008. 08. 13
  KAIST-TI Joint Workshop
Texas Instrument,
Dallas, TX
2008. 08. 15
  KAIST-IBIDEN Joint Workshop
Osaka, Japan
2008. 08. 18
  Chip-Package Co-design and Analysis for High-performance and Low Noise 3D Semiconductor Systems
Kyungbook University
2008. 10. 02
  High-Frequency TSV Model for High-speed Channel and PDN for 3D Semiconductor Systems
SiImage Inc. San Jose, CA
2008. 10. 24
  Design Considerations for Highly Integrated 3D SiP for Mobile Applications
EPEP pre-workshop,
San Jose, CA
2008. 10. 26
  Chip-Package Co-design and Analysis for High-performance and Low Noise 3D Semiconductor Systems
IEEE ASSCC Conference,
Fukuoka, Japan
2008. 11. 3~5

 

Year

Subject

Place

Date
2007   EMI Design Guide for 2 Layer Board
SiP Design Workshop,
COEX, Seoul
2007. 09
  Low Noise Design of SiP (System-In-Package):RFID, DMB, ZigBee, X/Ku band Transceiver, UWB
Molex Korea
2007. 01. 19
  SI, PI, and EMI Comparison of Fred’s 4L BGA Package Design with 2L BGA Package Design
SiImage, San Jose, CA
2007. 02. 05
  High-performance and Low Noise SiP Design
CEPM Day, KAIST
2007. 02. 23
  Analysis and Measurement of Jitter and ISI in High-speed Digital System

Samsung
EMC Consortium I

2007. 02. 27
  High-performance and Low Noise SiP Design
Hynix
2007. 03. 29
  Electromagnetic Noise Suppression at Automotive Systems in Ubiquitous and Digital Environment
Hanyang University
2007. 03. 30
  Samsung, EMC Consortium II
Samsung
EMC Consortium II
2007. 08. 23
  SiP Design for Wireless Communication and RFID
Jeju Island
2007. 09. 14
  SoC or SiP : What is the best solution in IC Business for Ubiquitous Mobile Platforms?
Jeju Island
2007. 11. 13
  Chip-Package Co-design and Analysis for Low Noise Wireless Communication SiP
Cadence SiP Forum, Seoul
2007 11. 15
  Signal Integrity, and Embedded Passives
Singapore
2007. 12. 10
  Signal Integrity, Power Integrity and SiP Design
Taiwan
2007. 12. 15
 
Year

Subject

Place

Date

2006

  Via in High-speed Package and PCB: A source of Simultaneous Switching Noise Generation, Coupling, Jitter, and Radiated Emission
Sungkyunkwan University
2006. 01. 06
  Ground Integrity: Design Principles and Measurements
Samsung EMC Consortium
2006. 02. 08
  SoC/SiP Design Challenges (3D Integration Rump Session, Korea Semiconductor Conference)
Jeju Island
2006. 02. 24
  Power Integrity and Ground Integrity (Tutorial, 17th International Zurich Symposium on Electromagnetic Compatibility)
Singapore
2006. 02. 27
  SiP Level Signal Integrity, Power Integrity, and Ground Integrity (SiP Design and Manufacturing Workshop)
KAIST
2006. 03. 31
  Reduction of EMI/EMC in PDP
Samsung Electronics Inc
2006. 04. 21
  Design and Measurement of 40GBbps Wire-bond Plastic BGA Package
Amkor Technology Korea
2006. 05. 02
  Advantages and Challenges of SiP Technologies
Hynix Semiconductor Inc
2006. 05. 25
  High-speed PCB Design for High-speed Digital Device Test System
Samsung Electronics
2006. 06. 27
  Signal Integrity, P/G Interity, EMI Design and Analysis
SunPlus, Taiwan
2006. 07. 19-21
  Ground Integrity: Design Principles and Measurements
IHPC, Singapore
2006. 10. 08
  Basic Design Principles of High-speed and High-density Connectors
Korea Electronics Exhibition
2006. 10. 19
  Low Noise Design of SiP (System-In-Package):RFID, DMB, ZigBee, X/Ku band Transceiver, UWB
IT SoC Fair, COEX, Korea
2006. 11. 02
  Electromagnetic Noise Suppression at Automotive Systems in Ubiquitous and Digital Environment
Hyundai Automotive Electronics Forum
2006. 11. 11
  Principles of Multi-Level Ground Integrity Design for Low Noise Circuit and Systems
EDAPS 2006, Sanghai, China
2006. 12. 17
 
Year

Subject

Place

Date

2005

  Digital Electromagnetic Waves in High-speed Semiconductor Systems
Korea Electronic Terminal Inc.
2005. 01. 06
  Research on Signal Integrity, Power Integrity, and EMI at
KAIST Teraherz Interconnection and Package Laboratory
SIMTECH, Singapore
2005. 01. 14.
  Digital Electromagnetic Waves in High-speed Package and PCB
IME, Singapore
2005. 01. 14
  Digital Electromagnetic Waves in High-speed Semiconductor Systems
KAIST Lecture in
Mechanical Eng. Open Class
2005. 01. 21
  Mesaurement of DVI and HDMI Cables
SiImage, CA, USA
2005. 02. 10
  EBG Structures for Low Noise Power/Ground Network in Multilayer Packages and PCBs
SiImage, CA, USA
2005. 02. 10
  Suppression of Simultaneous Switching Noise and Improvement of Noise Isolation by using Embedded Film Capacitor and EBG Structures in Multilayer Packages and PCBs
Rambus Inc., CA, USA
2005. 02. 11
  Advantages and Challenges of System-on-Package
Technology
Samsung Electro-
mechanical Inc.
2005. 03. 15
  System-on-Package UWB Pulse Generator
LG-KAIST-China Workshop
2005. 05. 13
  EMI/EMC Issues of Digital Electromagnetic Waves in High-speed Package and PCB Design
ADD RDRC Seminar
2005. 05. 19
  Low Noise PCB Design by Using Embedded Film Capacitor
Samsung-KAIST EMI/EMC Consortium Workshop
2005. 06. 23
  Low Noise PCB Design by Using Embedded Film Capacitor
CNU Electromagnetic
Environment Center Workshop
2005. 06. 27
  Power Integrity Simulation and Analysis of Saturn Test PCB
at SiImage
SiImage Inc.
2005 .08. 12
  Analysis and Measurement of Jitter and ISI in High-speed
Digital System
IDEC Jitter Seminar
2005. 09. 09
  Digital Electromagnetic Waves in High-speed Semiconductor Systems
Ansoft Worldwide Technical Seminar, Keynote Speech
2005 .10. 05
  Return Current Path: Source of Noise Generation and Coupling
Samsung Electronics Inc.
Memory Division
2005. 10. 05
  Digital Electromagnetic Waves in High-speed Semiconductor Systems
AIST(Advanced Institute of Science and Technology),
Japan, Tsukuba
2005. 10. 07
  Return Current Path: Source of Noise Generation and Coupling
Samsung CAE Conference
2005. 11. 30
  Signal Integrity and Power Integrity
Tutorial, EDAPS2005,
Bangalore, India
2005. 12. 12
  EMI/EMC Issues in High-performance Digital Systems
Samsung Electronics Inc.
Video Display Division
2005. 12. 28
 
Year

Subject

Place

Date
2004   Picosecond UWB Pulse Generation, Propagation and Detection Korea UWB Forum 2004. 01. 13
  Low Inductive Impedance and Resonance Design of Power/Ground Network for High-speed Package and PCB Silicon Image 2004. 01. 30
  Power/Ground Network Analysis of TQFP with
Custom Design vs. Open Tool (LPC), Silicon Image
ung CAE, gital Package and PCB, dl nnectorT, age, Samsung Electronics 2004. 02. 11
  Fundamental Principles of High-speed Single-ended and Differential Signaling on PKG and PCB
Intel 2004. 02. 13
  Low Inductive Impedance and Controlled Resonance Design
of Low Noise Power Distribution Network for High-speed
Package and PCB
Chungnam University 2004. 03. 11
  Design of Low Noise Power Distribution Network for
High-speed Package and PCB
Amkor 2004. 05. 11
  SiP Design for High-speed Interface, Low Noise
Power/Ground, and Suppressed EMI
IDEC 2004. 06. 18
  Low Noise Power/Ground Network Design for High-speed
and System-On-Package, and PCB
Korea Electronics
Technology Institute
2004. 07. 26
  Need for SoP Technology and Research Activities in
University Laboratories
SoP Workshop 2004. 07. 20
  Signal Channel and Power/Ground Network Design for
High-speed and Low Noise IC, System-On-Package, and PCB
Testech 2004. 07
  Via : A source of Simultaneous Switching Noise,
Power/Ground Plane Resonance, Noise Coupling, and
Edge radiation in High-speed Multi-layer PCB and SiP
IEEE CPMT Phoenix
Chapter Meeting
2004. 08. 17
  Lecture Series: Hyundai Motors, "EMI/EMC Design for Auto-Mobile" Reach Lecture three hours 2004. 09 ~
2005. 08
  Simultaneous Switching Noise and Decoupling Design in
High-speed Digital PCB
EMC Korea 2004. 10. 26
  EMI/EMC Design and Analysis Samsung 2004. 10. 07
  Advantages and Challenges of System-on-Package Technology Korea Electronics
Technology Institute
2004. 10. 08
  Via : A source of Noise Generation and Coupling CST User Conference 2004. 10. 19
  Via : A source of Simultaneous Switching Noise Generation, Coupling, and Edge Radiated Emission in High-speed Multi-layer Digital PCB KJJC 2004. 11. 23
  Suppression of GHz Range Power/Ground Inductive Impedance and Simultaneous Switching Noise using Embedded Film Capacitors in Multilayer Packages and PCBs EDAPS 2004 2004. 11. 29
  Via in High-speed Package and PCB: A source of Simultaneous Switching Noise Generation, Coupling, Jitter, and Radiated Emission Samsung Electronics 2004. 11. 18
  Digital Electromagnetic Waves in High-speed Semiconductor Systems Samsung Semicon 2004. 12. 07
 
Year

Subject

Place

Date
2003   Suppression, Isolation and Shield of Power/Ground Noise in High-speed Digital Package and PCB
Samsung CAE
2003. 05. 22
  Suppression, Isolation and Shield of Power/Ground Noise in High-speed Digital Package and PCB
ICU
2003. 06. 09
  Signal Channel and Power/Ground Network Design
for High-speed and Low Noise IC, SoP and PCB
2003. 06. 09
  Signal Channel and Power/Ground Network Design
for High-speed and Low Noise IC, SoP and PCB
LG Innotech
2003. 07. 18
  Signal Channel and Power/Ground Network Design
for High-speed and Low Noise IC, SoP and PCB
Amkor
2003. 07. 24
  Low Inductive Impedance and Resonance Design of Power/Ground Network for High-speed Package and PCB to Reduce SSN and Radiated Emission
IBM Yorktown
2003. 10. 31
 
Year

Subject

Place

Date
2001   EMI/EMC Issues on High-speed Digital Systems
Samsung SDI
2001. 01. 12
 
Year

Subject

Place

Date
2000   Now Noise and High-speed Interconnection and Package
Chip Pack
2000. 02. 21
  Now Noise and High-speed Interconnection and Package
IDEC
2000. 02. 24
  Now Noise and High-speed Interconnection and Package
Anam Semicon
2000. 03. 16
  Terahertz Optoelectronics
Gyungbuk University
2000. 03. 30
  Applications of Terahertz Optoelectronics
GIST
2000. 04. 14
  Technology Trends of GHz Digital Interconnection and Package
POSTECH
2000. 05. 19
  EMI Issues on High-speed Digital Systems
Seoul University
2000. 07. 07
  Direction of GHz Interconnection
Korea Electric Terminal Co., LTD.
2000. 08. 09
  Applications of THz Imaging for Medical Applications
Gyungsang University
2000. 08. 17
  Direction of GHz Interconnection and Connectors
Molex Korea
2000. 12. 26
 
Year

Subject

Place

Date
1999   Low Noise and High-speed Interconnection and Package
Samsung Semicon
1999. 01. 07
  EMI/EMC Issues on High-speed Digital Interconnection and Package
KAIST
1999. 02. 11
  Design and Model of High-performance Packages
ETRI
1999. 02. 27
  Reduction of Radiation from High-speed Digital Circuits
IDEC
1999. 04. 08
  Flip-chip Electrical Modeling
Asymtek
1999. 03. 26
  Applications of THz Imaging for Medical Applications
Samsung Electronics
1999. 08. 27
  Now Noise and High-speed Interconnection and Package
LG Electronics
1999. 09. 09
  Applications of THz Imaging for Medical Applications
Kangnam CMC
1999. 10. 08
  Applications of Picosecond/Terahertz Optoelectronics
University of California
at San Diego US
1999. 10. 28
  Now Noise and High-speed Interconnection and Package
KIST
1999. 11. 09
  Now Noise and High-speed Interconnection and Package
Samsung Semicon
1999. 12. 03
 
Year

Subject

Place

Date

1998

  Direction of Electronic Package Research Activity
Korea Electomagnetic
Engineering Society
1998. 06. 19
  Ultrafast Optical Techniques for Millimeter Device
and Circuit Testing
Osaka University Japan
1998. 07. 08
  Suppression of EMI in IC Design
IDEC
1998. 09. 11
  EMI/EMC Issues on High-speed Digital Interconnection and Package
Chungnam University Korea
1998. 10. 28
  EMI/EMC Issues on High-speed Digital Interconnection and Package
Komerix
1998. 11. 01
  Extraction of Interconnection and Package Model Using S-Parameter measurement and TDR
Hyundai Electronics
1998. 11. 19
  EMI/EMC Issues on High-speed Digital Interconnection and Package
Georgia Tech. US
1998. 12. 02
  Non-contact THz Spectroscopy for Water, Metal and Semiconductor
Korea Research Institute of standards and Science
1998. 12. 02
 
Year

Subject

Place

Date
1997   Reduction of Electomagnetic Radiation LG Electronics 1997. 12. 02
  Reduction of Electomagnetic Radiation LG Semicon 1997. 12. 05
 
Year

Subject

Place

Date

1996

  Femtosecond Electronics Based on Short Pulse Lasers
Electric Optical Center (KAIST)
1996. 04. 05
  High-speed VLSI Interconnection Technology
Korea Science and
Engineering Foundation
1996. 04. 25
  Electrical Design of High-Speed Packaging
Motorola Korea
1996. 05. 30
  Femtosecond Electronics Based on Short Pulse Lasers
Korea Research Institute of standards and Science
1996. 07. 08
  Reduction of Radiation from Digital Circuits
Samsung Electronics
1996. 08. 29
  Femtosecond Electronics
ETRI
1996. 10. 27
  The Future of 21th Century’s Electrical Engineering
Kyunggi Science High School
1996. 10. 29
  Speed Limit of High-Speed VLSI System
ETRI
1996. 11. 07
  Femtosecond Electronics
ETL Tsukuba Japan
1996. 12. 02
  Femtosecond Electronics
Agency for Defense Development
1996. 12. 10