It is very honorable to meet our friends in this explosively
expanding internet world.
Our research group is composed of young students and scientists
who love challenges and achievements in the newly discovered
and developed engineering and scientific world.
We explore the new spectrums of electromagnetic waves that
are needed to come up with the desired bandwidth of the future
wired and wireless interconnection. Also the spectrum will
quite useful for other application areas such as high-speed
signal processing and wireless power transfer (WPT).
We have two different groups of research including the signal
integrity (SI) and power integrity (PI) in TSV-based 3D IC
group and WPT group. In the 3D IC group, we are evaluating
the design of signal lines and power distribution network
(PDN) in 3D-IC and suggesting the optimized design and devices
for improving the system performance. For the evaluation and
design guide, we model and measure the signal lines and PDN
in 3D IC in the frequency and time domain. Additionally, we
also focus on the advance package shceme for high integration
Today, the demand for wireless power transfer has been significantly
increased to achieve the smaller form factors and higher mobility.
In the WPT group, we are developing WPT systems in mobile
devices such as Smart phones, Smartwatches, TVs, Drones and
automotive vehicles. For this, we focus on the design of WPT
coil systems, electromagnetic field (EMF) shielding materials
such as ferrite and meta-materials and impedance matching
circuits for improved power transfer efficiency and low EMF.
We all want to be happy on their own personal life, at the
same time, enjoy our hard works. In the future, I hope that
the students will become the leaders of their research areas
and believe that is the way how we can help the humans and
our earth get better everyday.
We love waves, that is how we can communicate!