2020

1. H. Park et al., "Deep Reinforcement Learning-Based Optimal Decoupling Capacitor Design Method for Silicon Interposer-Based 2.5-D/3-D ICs," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 3, pp. 467-478, March 2020

2. H. Park et al., “Policy Gradient Reinforcement Learning-based Optimal Decoupling Capacitor Design Method for 2.5-D/3-D ICs using Transformer Network,” 2020 Electrical Design of Advanced Packaging and Systems (EDAPS)(to be uploaded)

3. D. Lho et al., “Deep Neural Network-based Lumped Circuit Modeling Impedance Curve,” 2020 Electrical Design of Advanced Packaging and Systems (EDAPS)(to be uploaded)

4. K. Kim et al., “Deep Reinforcement Learning-based Through Silicon Via (TSV) Array Design Optimization Method considering Signal Integrity (SI),” 2020 Electrical Design of Advanced Packaging and Systems (EDAPS)(to be uploaded)

5. K. Son et al., “Deep Reinforcement Learning-based Interconnection Design for 3D X-Point Array Structure Considering Signal Integrity,” 2020 Electrical Design of Advanced Packaging and Systems (EDAPS)(to be uploaded)

6. B. Sim et al., "A Deep Neural Network-based Estimation of Efficiency Enhancement by an Intermediate Coil in Automotive Wireless Power Transfer System ," 2020 IEEE Wireless Power Transfer Conference (WPTC), Seoul, South Korea, 2020.(to be uploaded)

7. K. Kim et al., “Convolutional Neural Network-based Fast and Accurate Irregular Shape Power/Ground Plane Impedance Estimation Method for High-Speed Signaling,” 2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)(to be uploaded)

8. M. Kim et al., "Reinforcement Learning-based Auto-router considering Signal Integrity," 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, USA, 2020, pp. 1-3

9. B. Sim, D. Lho, D. Park, H. Park, H. Kang and J. Kim, "A Deep Neural Network-based Estimation of EMI Reduction by an Intermediate Coil in Automotive Wireless Power Transfer System," 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA, 2020, pp. 407-410

10. T. Shin et al., "Modeling and Demonstration of Hardware-based Deep Neural Network (DNN) Inference using Memristor Crossbar Array considering Signal Integrity," 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA, 2020, pp. 417-421

2019

2018